SFP product family supports applications forupto 6Gb/s perchannel.The connetoraccepts multiple transceiversper INF-8074i and combines, transmits, and receives functions in a low cost, compact format. The assemblies are designed to maximize valuable space on the PCB. The cages have a two-piece construction with enhanced transceiver mating tabs available in a Press-Fit version or a solder tail version. Light pipes are designed to deliver a “link” or “no link” status using LEDs attached on the PCB.
TARGET MARKETS
TECHNICAL INFORMATION
1
MATERIAL
-Housing: Black color, Glass reinforced, Lead Free Solder Reflow Process Compatible Thermo Plastic.
-Contacts Base Material: Phosphor Bronze.
-Plating Solder Tails: Matte tin or gold flash options.
-Plating Mating Area: Gold.
-Resonance Dampening Feature: Conductive Polymer.
2
MECHANICAL PERFORMANCE
-Durability: 250 mating cycles.
-Mating Force: 50 N max.
-Contact Normal Force: 100 grams.
-PCB Thickness Solder-Post and Press-Fit (Cage): 1.45 mm(0.057in.)
-PCB Thickness Belly to Belly (Cage): 3.00 mm(0.118in.)
-Unmating Force (Cage): 11.50 N max.
-Insertion Force to PCB (Cage):
-500 N for 1 port (1x1 cage)
-1000 N for 2 port (1x2 cage)
-2100 N for 4 port (1x4 cage)
-3000 N for 6 port (1x6 cage)
3
ELECTRICAL PERFORMANCE
-Operating Voltage: 30 VDC per contact.
-Operating Current: 0.5 A per contact.
-Differential Impedance: 100Ω +/- 10Ω.
4
ENVIRONMENTAL
-Operating and (Storage) Temperature: -55° to +85°C.
400 1048 018
597406795 
